BASLER - Microcrack Inspection System New Dimensions in Inline Crack Detection
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BASLER - Microcrack Inspection System – New Dimensions in Inline Crack Detection |
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In the photovoltaic industry, microcracks on wafers not only cause problems during the production process, but are also subsequently detrimental to the efficiency of the solar modules. Reliable detection of microcracks at an early stage of the process optimizes the production yield. With this in mind, Basler offer a reliable image-processing system designed especially for the photovoltaic industry to detect cracks of this nature in solar wafers.
The unit is available as offline or inline system. The offline version is externally onset with wafers, whereby the image is analyzed within a second. The online image-processing system is directly integrated into a production line and continuously inspects the wafers during the production process. This ensures that any mechanically impaired wafer is reliably detected and automatically rejected at an early stage. As the wafers pass through, the image-processing system photographs them with high-resolution line-scan cameras capable of resolving 50µm per pixel on a 6" wafer. The system is designed to inspect any of today's commonly used wafer formats and sizes, whether poly- or monocrystalline. An illumination unit specially designed for this field of application visualizes even cracks without any surface structure that would be undetectable in any traditional transmitted-light system. Perfected analytic software, specially designed for crack detection, enables you to distinctly detect and classify any cracks. The major difficulty in this respect is the differentiation between cracks and partially similar grain structures, the solution to which lies in a highly developed method of classifying the image content.
Summary
Courtesy of Balser |
