Feb 18, 2010 - Today, Advantech showcased the highest Intel-based processor core density to be integrated in a 3U MicroTCA system with redundant carrier hubs, power and cooling. Advantech's uniquely engineered UTCA-6302supports up to twelve Intel^® Core™ 2 Duo based processors in a full-size AMC format for optimal cooling, in just a 3U or 4U height the system introduces an innovative front-to-rear cooling scheme, advanced redundant power design, and is fitted with redundant MicroTCA Carrier Hubs (MCH) each with its own iA processor core.

More than Just Switching

Four GbE and four E1/T1 ports provide fresh options for backhaul and gateway needs, while the on-chip accelerator provides security co-processing options for functions such as encryption. Additionally, the Intel® EP80579 on the MCH runs a standard x86 Linux platform, providing opportunities for control and application processing, higher-level system and switch management, or boot server functions for in-system PrAMCs. It's the first MCH with an integrated x86 processor on the market, and allows one to do more than just switching and AMC management. It also integrates control plane and backhaul applications, without wasting an extra slot for a control plane module.

High Speed Backplane

At the center of Advantech's system, dual-core Intel® Core™2 Duo AMC processors provide exceptional levels of scalability for software designed hardware functions such as radio or host media processing. They provide the building blocks for unprecedented levels of reliability, performance and power savings. The MIC-5602Rev2PrAMCs loaded in the system, support Intel® 45nm Core™ 2 Duo low voltage processors (Penryn) with up to 4 GB memory and redundant GbE ports. A cost-optimized backplane supports the fabric switching infrastructure provided by the new generation UTCA-5504 MCH. The onboard carrier manager, 24-port non-blocking L2+ Ethernet switch, and Intel® EP80579 integrated processor with Intel® QuickAssist, open the doors to new levels of processing and connectivity on an MCH.

Redundant Power Supplies & Hot-swappable Fan Modules

The processor payload is safely cooled by four hot-swappable fans providing redundant cooling, while four rear -48V DC power supplies provide true 600W redundancy. By extending the depth of the chassis and moving the power modules to the rear, all the front-side slots are available for the AMC payload needs, and the entire system fits in a 3U envelope for bottom-to-top cooling. For front-to-rear cooling needs, the system comes with unique top and bottom angled air-duct designs allowing 4U lossless stacking between adjacent systems in a rack.

The system is ideal for high performance computing, and for application service providers where blade density is important. Telecom equipment manufacturers and network equipment providers will benefit from the performance, cost and reliability gains which are vital to keep them ahead of competition, especially in the wireless base station business where MicroTCA is gaining a strong foothold. Advantech successfully engineered this system to meet the needs of one infrastructure customer's aggressive design-to-cost goals without sacrificing functionality.

Fully integrated UTCA-6302 Systemsare available now for customer evaluation.

Advantech is exhibiting at the Mobile World Congress in Barcelona, Feb 15-18^th2010 in Hall 2 Booth G38.