Feb 16, 2010 - Advantech, a global manufacturer of telecom computing blades and multi-core network platforms, announced today it will reveal plans to key telecom OEMs related to its 2Q10 introduction of DSP-based processing blades.

Advantech to Enter the DSP Boards and Systems Business

"DSP technology is evolving fast with dramatic progress in core density, software and development tools and we are expecting good growth in the market in 2010 through strong demand from the communications sector” said Franz Wei, Vice President of Advantech. "In close consultation with two prominent DSP ecosystem specialists, Texas Instruments and ENEA, we are preparing to formally launch Advantech in to the DSP boards and systems business. We have been strengthening R&D resources with new talent throughout 2009 and the team’s expertise is extremely valuable in developing DSP solutions targeted at voice, video and wireless. We also expect solid penetration into the medical imaging marketplace where the latest DSP technology is primed to transform tomorrow’s healthcare equipment."

Advantech indicated that the first in a series of Advantech products would be introduced at the NAB show in Las Vegas this April. Mobile World Congress was chosen for today’s announcement because it is a melting pot where key system design architects and decision makers from the leading equipment manufacturers meet to orchestrate next generation design strategies and set development directions.

“To keep up with increasing capacity demands, Telecom Equipment Manufacturers and Network Equipment Providers are specifying higher-performance, higher density DSP-based communications equipment which needs to operate on significantly lower power budgets," said Brian Glinsman, General Manager of Communications Infrastructure at TI DSP Systems.“We are pleased to see Advantech’s investment in high density, lower power designs on multiple form factors and we welcome them to our expanding DSP ecosystem providing wider customer choice.”

Advantech and ENEA Collaborate to Build Comprehensive Solutions

Advantech announced that they are working closely with ENEA, who provides optimized multicore support for TI DSPs in their ENEA OSEck® RTOS, to offer full software support for the first products they sample next quarter. ENEA has a comprehensive DSP runtime and development suite including the ENEA LINX® scalable and reliable messaging layer, plus secure IP/signaling/NGN media networking protocols that deliver exceptional reliability, performance, and time-to-market acceleration for DSP designs. ENEA dSPEED® data plane management framework and ENEA Optima® eclipse-based system debugging tools support comprehensive, remote management/monitoring of deployed systems, and system level visualization in the design lab.

“Having successfully worked together in 2009 to validate ENEA® ELEMENT on Advantech’s ATCA blades, we are excited to collaborate further on their groundbreaking new DSP designs” said Robert Monkman, Director of Strategic Alliances at ENEA.“When you’re working with DSP board densities as high as those being developed at Advantech, our comprehensive DSP software framework will offer compelling benefits to mutual customers in terms of accelerated deployment, efficient platform software for distributed applications and enhanced manageability in the network .”

Eddie Lai, Director of Business Development at Advantech Networks and Telecom Group summarized today’s release “We’re very excited about the opportunities we are seeing in the market right now and we anticipate that the DSP sector will be positively influenced by a new entrant like Advantech.” Said Lai,, “As major OEM’s turn more to collaborative design partnerships than pure outsourcing, a strong Embedded Market player like Advantech, with solid financials and skillful Asia-based design and manufacturing services makes a compelling new partner to work with.”

Further details will be released by Advantech in April 2010.

Advantech is exhibiting at the Mobile World Congress in Barcelona, Feb 15-18^th2010 in Hall 2 Booth G38.